ANSI/NEMA ICS2 Edition-1993 额定值不超过交流2000V或直流750V的工业控制和系统控制器、压力机和过载继电器

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【英文标准名称】:IndustrialControlandSystemsControllers,Contractors,andOverloadRelaysRatedNotMoreThan2000VoltsACor750VoltsDC
【原文标准名称】:额定值不超过交流2000V或直流750V的工业控制和系统控制器、压力机和过载继电器
【标准号】:ANSI/NEMAICS2Edition-1993
【标准状态】:作废
【国别】:美国
【发布日期】:1993
【实施或试行日期】:
【发布单位】:美国国家标准学会(ANSI)
【起草单位】:
【标准类型】:()
【标准水平】:()
【中文主题词】:过载继电器;控制设备;工业流程测量;电气工程
【英文主题词】:electricalengineering;industrialprocessmeasurement;controlequipment;overloadrelays
【摘要】:
【中国标准分类号】:N17
【国际标准分类号】:25_040_40;29_130_20;29_120_50
【页数】:
【正文语种】:英语


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【英文标准名称】:RegulatorTerminology
【原文标准名称】:调节器术语
【标准号】:ANSI/FCI86-2-1991
【标准状态】:作废
【国别】:美国
【发布日期】:1991
【实施或试行日期】:
【发布单位】:美国国家标准学会(ANSI)
【起草单位】:
【标准类型】:()
【标准水平】:()
【中文主题词】:流体技术;压力调节器
【英文主题词】:pressureregulators;fluidtechnologies
【摘要】:
【中国标准分类号】:N10
【国际标准分类号】:23_060_40
【页数】:
【正文语种】:英语


Product Code:SAE J1752/2
Title:Measurement of Radiated Emissions from Integrated Circuits -- Surface Scan Method (Loop Probe Method) 10 MHz to 3 GHz
Issuing Committee:Electromagnetic Compatibility (Emc) Standards
Scope:This SAE Recommended Practice defines a method for evaluating the near field electric or magnetic component of the electromagnetic field at the surface of an integrated circuit (IC). This technique is capable of providing a detailed pattern of the RF sources internal to the IC. The resolution of the pattern is determined by the characteristics of the probes used and the precision of the mechanical probe positioner. The method is usable over the 10 MHz to 3 GHz frequency range with existing probe technology. The probe is mechanically scanned according to a programmed pattern in a plane parallel or perpendicular to the IC surface and the data is computer processed to provide a color-enhanced representation of field strength at the scan frequency. This procedure is applicable to measurements from an IC mounted on any circuit board that is accessible to the scan probe. For comparisons, the standardized test board shall be used. This diagnostic procedure is intended for IC architectural analysis including functional floor plan and power distribution.